发明名称 LASER BEAM MACHINING DEVICE AND LASER BEAM MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device which can efficiently form a plurality of lines of a reformed region inside a workpiece to one scheduled cutting line. <P>SOLUTION: A laser beam L1 and a laser beam L2, which mutually have different widening angles, are condensed to the inside of the workpiece 1 by a condensing lens 31 in the laser beam machining device. At this time, since the laser beam L2 has the larger widening angle compared with the laser beam L1, the condensing point P1 of the laser beam L1 is aligned to a shallow position from the surface 3 of the workpiece 1 and the condensing point P2 of the laser beam L2 is aligned to a deep position from the surface 3. The condensing point P1 and the condensing point P2 are moved along the scheduled cutting line 5 of the workpiece 1 by the driving of a stage on which the workpiece 1 is laid. Accordingly, two lines of the reformed region 7a, 7b can be formed by one scan along the scheduled cutting line 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004337902(A) 申请公布日期 2004.12.02
申请号 JP20030136256 申请日期 2003.05.14
申请人 HAMAMATSU PHOTONICS KK 发明人 FUKUMITSU KENJI;FUKUYO FUMITSUGU
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/04;B23K26/06;(IPC1-7):B23K26/00 主分类号 B23K26/00
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