| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device which can sufficiently make use of the characteristics as an insulating material; is applied to a semiconductor component, a printed board, and a package substrate; and realizes a high transmission speed of a transmission signal by precisely controlling film formation, and forming an insulating film by using the insulating material, especially, the insulating material which is represented by a low dielectric material such as a PPE (polyphenylether) resin, and the material in which single film formation is difficult. SOLUTION: An insulating substrate 13 is cut by using bytes 10 of diamond and the like. All glass cloth 11 and a surface layer of a PPE film 12 are simultaneously cut and removed until an upper face of a via part 3 is exposed. Thus, a thin wiring layer 5 which covers wiring 2 and the via part 3 and whose surface is flattened is formed in an interlayer insulating film 4. COPYRIGHT: (C)2005,JPO&NCIPI |
