| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board from which a sufficient thermal expansion suppressing effect can be obtained without causing any restriction on the higher density and higher precision of via holes. SOLUTION: A circuit pattern 24 is formed on the conductor layer 23 for circuit of a three-layer laminated material composed of the conductor layer 23, an insulating substrate layer 22, and a low-thermal expansion metallic layer 21. Lower holes 25 having larger diameters than the via holes 27 have are formed in the metallic layer 21. Then an adhesive layer 26 is provided on the surface of the metallic layer 21, and the via holes 27 are formed through the insulating substrate layer 22, metallic layer 21, and adhesive layer 26. In addition, a conductive material 29 which performs interlayer conduction is packed in the via holes 27. COPYRIGHT: (C)2005,JPO&NCIPI |
