| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which responds to an increase in density of an electronic apparatus and a higher signal processing speed, and also to provide its manufacturing method. SOLUTION: On both faces of an insulation base material 11, a ground layer 21a and interconnection layers 21b and 21c are formed, and furthermore, filled vias 52, a signal line 61a, interconnection layers 61b and 61c, and an IVH 53 are formed via an insulation layer 12 to form a core substrate 40. On both faces of the core substrate 40, filled vias 55, ground layer 61a, outer layer land 62b, through hole 56, and solder resist 81 are formed via an insulation layer 13 having a dielectric constant different from that of the insulation layer 12. The ground layer 21a and the ground layer 62a are electrically connected to each other by the filled vias 52 and 55 of a stacked via structure. The signal line 61a has the strip line structure of a square coaxial structure surrounded by a conductor of a ground level. COPYRIGHT: (C)2005,JPO&NCIPI |
