发明名称 METHOD OF PRODUCING COPPER BASED LOW THERMAL EXPANSION HIGHLY HEAT CONDUCTIVE MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a method for easily producing a sintered material in which an Invar alloy is dispersed into a copper based matrix, in providing a material which has more satisfactory dimensional precision and excellent workability and can be plated with nickel without using expensive materials such as molybdenum and tungsten as in the prior art, in a copper based alloy material for a member requiring a low thermal expansion coefficient and high heat dissipation properties such as a heat sink. SOLUTION: A powdery mixture obtained by mixing, to copper powder, 5 to 60 mass% iron based alloy powder whose thermal expansion coefficient up to 100°C is≤6×10<SP>-6</SP>/K is subjected to compression molding to≥93% relative density, and is thereafter sintered at 400 to 600°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004339536(A) 申请公布日期 2004.12.02
申请号 JP20030134305 申请日期 2003.05.13
申请人 HITACHI POWDERED METALS CO LTD 发明人 ISHIJIMA ZENZO
分类号 C22C1/04;B22F1/00;C22C9/00;H01L23/36;(IPC1-7):C22C1/04 主分类号 C22C1/04
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