| 摘要 |
PROBLEM TO BE SOLVED: To obtain a novel epoxy resin which gives a cured product excellent in moisture resistance and heat resistance and suitably employable for insulating materials for printed wiring boards, a semiconductor-sealing material, and the like, in electric or electronic fields, and a low viscous epoxy resin composition comprising the same. SOLUTION: The novel epoxy resin is represented by formula (1) (wherein (n) is an integer of 0-5; and G is a glycidyl group) and is obtained by reacting an oxymethylene compound represented by formula (2) with epichlorohydrin. The epoxy resin composition comprises the epoxy resin. COPYRIGHT: (C)2005,JPO&NCIPI
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