发明名称 METHOD OF FORMING LDD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of forming an LDD of a semiconductor device. SOLUTION: A substrate having a polysilicon layer having a first region and a second region on itself is provided. The first region is exposed to form a patterned photoresist layer for covering the second region on the polysilicon layer. The photoresist layer for covering the second layer is provided with a center portion and an edge portion, and the center portion is made thicker than the edge portion. Next, ion implantation process is performed, using the photoresist layer as a mask for forming a source/drain in the first region of the polysilicon layer and the LDD in the second region below the edge portion of the photoresist layer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004343034(A) 申请公布日期 2004.12.02
申请号 JP20030349127 申请日期 2003.10.08
申请人 AU OPTRONICS CORP 发明人 SHIH MING-SUNG
分类号 G03F7/20;H01L21/027;H01L21/20;H01L21/265;H01L21/266;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):H01L21/336 主分类号 G03F7/20
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