Economical method of manufacturing features in a ceramic circuit board

摘要

This invention is a method of forming features, such as counter-bore holes in a circuit board assembly. A first and second substrate are processed and counter-bore holes are formed in the first substrate. After the holes are formed, sealing glass is deposited on the bottom side of the first substrate and the top side of the second substrate and is sintered on the bottom side of the first substrate and the top side of the second substrate. After sintering, the bottom side of the first substrate is fixtured to the top side of the second substrate and the first and second substrate are refired, causing the sealing glass to reflow and fuse the bottom side of the first substrate to the top side of the second substrate. Finally, the first and second substrate are cooled.