发明名称 |
Substrate for stressed systems and method of making same |
摘要 |
A stress absorbing microstructure assembly including a support substrate having an accommodation layer that has plurality of motifs engraved or etched in a surface, a buffer layer and a nucleation layer. The stress absorbing microstructure assembly may also include an insulating layer between the buffer layer and the nucleation layer. This assembly can receive thick epitaxial layers thereon with concern of causing cracking of such layers. |
申请公布号 |
US2004241902(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20040755007 |
申请日期 |
2004.01.08 |
申请人 |
LETERTRE FABRICE;GHYSELEN BRUNO;RAYSSAC OLIVER |
发明人 |
LETERTRE FABRICE;GHYSELEN BRUNO;RAYSSAC OLIVER |
分类号 |
B81C1/00;H01L21/20;H01L21/762;(IPC1-7):H01L21/44 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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