发明名称 |
Bonding together of two different and/or similar substrates involves joining the substrates with adhesive and subjecting to irradiation |
摘要 |
Substrates, which may or may not be joined together by suitable joining materials or adhesive systems are subjected to irradiation with electrons, gamma rays, neutrons or other forms of radiation. Substrates may be of metal, ceramic or glass reinforced plastic. |
申请公布号 |
DE10348266(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
DE2003148266 |
申请日期 |
2003.10.07 |
申请人 |
BEHR, MICHAEL;ROSENTRITT, MARTIN |
发明人 |
BEHR, MICHAEL;ROSENTRITT, MARTIN |
分类号 |
B29C65/00;B32B37/12;B32B38/00;C08J3/28;C08J5/12;C09J5/00 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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