SEMICONDUCTOR PACKAGE DEVICE WITH METAL PATTERN FOR CONTACTING FINE BONDING PAD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package device and a manufacturing method thereof are provided to apply a packaging process regardless of the fineness of a bonding pad by using a metal pattern with larger size than size of the bonding pad. CONSTITUTION: A semiconductor chip(20) includes a plurality of bonding pads(21) with a fine size and distance. A planarizing layer(22,23) with an opening for exposing the bonding pad is formed on the semiconductor chip. A metal pattern(27) with larger size than size of the bonding pad is formed on the planarizing layer to contact at least a portion of the bonding pad. A seed metal film(26a) is formed between the planarizing layer and the metal pattern. A stress lessening oxide layer(24) is formed between the planarizing layer and the seed metal film.