| 摘要 |
The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the stencil from the dies, the edges of the encapsulating material are partially cured in order to prevent or minimize slump of the encapsulant in the time period between removal of the stencil and full curing of the encapsulant. In particular, the stencil can be provided with a plurality of light pipes that terminate at the edges of the apertures within which the dies are placed. Ultraviolet (UV) or other curing light is provided through the light pipes to the edges of the encapsulating material. Some general or localized heating can be provided to enhance or accelerate the light curing of the edges of the encapsulant, but without substantially curing the remainder of the encapsulating material. |
