THICK-FILM CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thin-film circuit board which can be manufactured at a low cost and its manufacturing method, and an integrated circuit device. SOLUTION: A 1st thin-film circuit board is made of a copper-based conductor whose conductor layer 3 is burnt below 750°C and a conduction part 2 is made of a silver-based conductor. A 2nd thin-film circuit board has a conductor, which closes at least one opening part, in a through hole. This thin-film circuit board has the effect that the circuit board can be manufactured at low cost and the effect that a decrease in conductivity during use is suppressed. COPYRIGHT: (C)2005,JPO&NCIPI