| 摘要 |
PROBLEM TO BE SOLVED: To provide an exposure condition control method by feedforward / feedback in which the effects of a difference between processing conditions such as a processing apparatus and a wiring layer (layer) more meticulously reflected corresponding to the improvement of processing requirement accuracy. SOLUTION: In the case of controlling the exposure condition in the semiconductor exposure process by feeding back a misalignment measurement amount and a result of size measurement after the exposure, the measurement results used for the feedback are totalized by each of the processing apparatuses used for the wiring layer (layer) in addition to a production item, the wiring layer (layer), the processing apparatus, and a reticule; and the processing apparatuses are managed as a group of the processing apparatuses resulting from collecting the processing apparatuses the result of processing of which shows equal tendencies of the misalignment measurement results or the like after the exposure processing. COPYRIGHT: (C)2005,JPO&NCIPI
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