发明名称 |
SEALING MATERIAL FOR ELECTRICAL/ELECTRONIC APPLIANCE |
摘要 |
A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulas of 20 N/cm<2> or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher. |
申请公布号 |
WO02084918(A3) |
申请公布日期 |
2004.12.02 |
申请号 |
WO2002JP01494 |
申请日期 |
2002.02.20 |
申请人 |
NITTO DENKO CORPORATION;TACHIBANA, KATSUHIKO |
发明人 |
TACHIBANA, KATSUHIKO |
分类号 |
B32B5/18;B32B27/00;C09J7/02;C09J167/00;C09J175/04;C09J201/06;H04M1/18;H05K5/06 |
主分类号 |
B32B5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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