发明名称 SEALING MATERIAL FOR ELECTRICAL/ELECTRONIC APPLIANCE
摘要 A shaped sealing material for electrical/electronic appliances which is free from dust particle adhesion thereto and is easy to handle although it is a sealing material obtained by forming a pressure-sensitive adhesive layer on a foam. A layer comprising a pressure-sensitive adhesive composition having a storage modulas of 20 N/cm<2> or higher is formed on a surface of a finely cellular foam to constitute a sealing material having an adhesive force of 5.0 N/20 mm width or higher.
申请公布号 WO02084918(A3) 申请公布日期 2004.12.02
申请号 WO2002JP01494 申请日期 2002.02.20
申请人 NITTO DENKO CORPORATION;TACHIBANA, KATSUHIKO 发明人 TACHIBANA, KATSUHIKO
分类号 B32B5/18;B32B27/00;C09J7/02;C09J167/00;C09J175/04;C09J201/06;H04M1/18;H05K5/06 主分类号 B32B5/18
代理机构 代理人
主权项
地址