发明名称 |
SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS THEREON |
摘要 |
<p>A method of retaining a solder mass (40) to a solder-bearing article (20) is provided and includes the steps of: (a) disposing a length of solder mass over at least some of the plurality of openings (30); and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.</p> |
申请公布号 |
WO03085697(A9) |
申请公布日期 |
2004.12.02 |
申请号 |
WO2003US10149 |
申请日期 |
2003.04.01 |
申请人 |
INTERPLEX NAS, INC.;SEIDLER, JACK;ZHITOMIRSKY, ALEKSANDR |
发明人 |
SEIDLER, JACK;ZHITOMIRSKY, ALEKSANDR |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):H01R4/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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