发明名称 |
Bump bonding apparatus and method |
摘要 |
Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection. |
申请公布号 |
US2001042771(A1) |
申请公布日期 |
2001.11.22 |
申请号 |
US20010911801 |
申请日期 |
2001.07.25 |
申请人 |
NARITA SHORIKI;IMANISHI MAKOTO;MAE TAKAHARU;KANAYAMA SHINJI;WATANABE NOBUHISA |
发明人 |
NARITA SHORIKI;IMANISHI MAKOTO;MAE TAKAHARU;KANAYAMA SHINJI;WATANABE NOBUHISA |
分类号 |
H01L21/00;H01L21/68;(IPC1-7):B23K20/14;B23K1/00;B23K35/12;B23K31/02 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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