发明名称 |
Electronic arrangement and associated process |
摘要 |
The basic principle of the invention is that a power electronic component, e.g. a diode, is shrunk into a heat sink (20) and provided with terminals (12) and (14), the latter being connected to the base (15) of the diode. To insulate electrically the diode from the heat sink the latter is coated with a wire enamel or ceramic and/or powder coating. |
申请公布号 |
EP1274129(A3) |
申请公布日期 |
2004.12.01 |
申请号 |
EP20020012596 |
申请日期 |
2002.06.06 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
GADEMANN, LOTHAR;VETTER, GUENTER;JACOB, WOLFGANG |
分类号 |
H01L21/98;H01L25/11;(IPC1-7):H01L25/11 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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