| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a pin grid array package which makes a high density mounting on a printed circuit board possible. SOLUTION: For the socket for PGA package 1, a sliding plate 2 is made to slide between an open position (left side) and a close position (right side) according to the rotation of a cam member 5 arranged in the direction of penetrating a base housing 4 and the sliding plate 2. The first stopper 19, locking into one peripheral side 17b of an arm 17 of the cam member 5, is mounted on the upper surface of the sliding plate 2 at one side of the position where the cam member 5 penetrates the sliding plate, and the second stopper 20, locking into the other peripheral side 17c of the arm 17, is mounted on the other side. A plane on which, one peripheral side 17b of an arm 17 is to be locked into the first stopper 19, and a plane on which, the other peripheral side 17c of an arm 17 is to be locked into the second stopper 20, are made to offset in the sliding direction of the sliding plate 2, conforming to the sliding distance X of the sliding plate 2.
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