| 摘要 |
semiconductor engineering. SUBSTANCE: insulating plate of integrated circuit is built of two parts whose undersides are attached to each other through sealed joint; chips are placed in bottom depressions provided with holes filled with electricity conducting material. Depressions are made on front-face areas of both parts of plate. Lid is attached to front-face areas of plate parts through sealed joint. EFFECT: reduced mass and size, enhanced strength and reliability, facilitated manufacture. 3 cl, 2 dwg |
