Method of making an anisotropic conductive polymer film on a semiconductor wafer

摘要

The invention relates to a method of manufacturing anisotropic conductive polymer film (23 and 24) on a semiconductor wafer (T) comprising, on one surface, a layer of passivation (12) in which at least one opening is made to allow access to a contact pad (11). The invention applies to the creating of components (chips, integrated circuits) with high-density interconnections.