| 摘要 |
<p>A memory card of specified thickness fabricated by attaching a substrate to a cap without projecting the edge of the substrate from the rear surface of the cap. A substrate having a sealing part is bonded to a recess in the cap without projecting the peripheral edge of the substrate from the recess to the rear surface of the cap and the substrate is so warped to project, at the central part thereof, away from the cap through difference in the coefficient of thermal expansion between the materials forming the sealing part and the substrate. The recess includes a shallow recess receiving the substrate part and a deep recess receiving the sealing part wherein the shallow recess is deeper than the sum of the thickness of the substrate and the thickness of adhesive for bonding substrate to the bottom of the shallow recess, and the peripheral edge of the substrate is received in the shallow recess without projecting from the rear surface of the cap. The cap is a card having a thickness of several millimeters. A memory chip and a control chip for controlling the memory chip are provided in the sealing part thus constituting a memory card.</p> |
