| 发明名称 |
POLISHING BODY FOR CMP POLISHING, CMP POLISHING APPARATUS, CMP POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A polishing body for CMP polishing is disclosed which is preferably used in a CMP polishing method which enables to prevent excess polishing of the peripheral surface of a wafer. This polishing body for CMP polishing is composed of a polishing pad, a hard elastic member and a soft elastic member bonded together in this order, and the thickness of the soft elastic member is not more than a half of the thickness of the polishing pad.</p> |
| 申请公布号 |
WO2004105113(A1) |
申请公布日期 |
2004.12.02 |
| 申请号 |
WO2004JP06859 |
申请日期 |
2004.05.14 |
| 申请人 |
NIKON CORPORATION;HOSHINO, SUSUMU;YOSHIDA, NORIO;KITADE, YUKO;SHIMODA, OSAMU;YABUKI, TAKEYA |
发明人 |
HOSHINO, SUSUMU;YOSHIDA, NORIO;KITADE, YUKO;SHIMODA, OSAMU;YABUKI, TAKEYA |
| 分类号 |
B24B37/24;B24D13/14;(IPC1-7):H01L21/304;B24B37/00 |
主分类号 |
B24B37/24 |
| 代理机构 |
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