Preparation method for protecting the back side of a wafer and back side protected wafer

摘要

Preparation of wafer (1) comprises applying a cap layer (4) on or in the backside (3) surface of the wafer and creating functional structures (16) on or in front side (2) of the wafer during the fabrication process. An independent claim is included for wafer e.g. silicon on insulator or silicon on quartz type wafer comprises front and back sides, functional structures on front side of wafer surface and cap layer on or in the back side of surface of wafer.