CERAMIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable ceramic circuit board having strength enough to avoid deformation and high cooling performance. SOLUTION: The ceramic circuit board 1 having a circuit 3 for mounting a semiconductor component 4 has a hollow 2 for forming a refrigerant flow passage in a lower part of the circuit 3 for mounting the component 4. This meets the condition that the distance t from the circuit 3 to the hollow 1 in the substrate thickness direction meets 0.5 mm<=t<=5 mm, and the distance t and the width Y of the hollow 2 relate so that Y<=20t.