MOUNTING BOARD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable a mounting structure of a semiconductor element whose protruding electrodes are arranged in line passing through about the center of a forming surface of electrode terminals, surely to mount on a board by means of flip chip bonding. SOLUTION: In a mounting board 20 which mounts the semiconductor element 10 provided with the protruding electrodes 12 in each electrode terminal by flip chip bonding, in a manner that the electrode terminals are arranged in line passing through about the center of the forming surface of electrode terminals, it is characterized in that openings 30 are formed in the mounting surface of semiconductor bound 20 in such a manner that a protective coat 32 covered on the surface of substrate 20 is opened in rectangular shape along the column direction of the protruding electrodes 12, and bonding electrodes 22 adhered with solder bonding the protruding electrodes 12 on the surface are provided arranging the same distance as that of column direction of the protruding electrodes 12 in the openings 30 is parallel individually.