| 摘要 |
A cooling arrangement includes at least one support element (12), at least one electrical component mounted on the support element (12), and at least one cooling body (22, 24) mounted on the support element (12) for removing heat produced from the component (10). The support element (12) has at least one heat-conducting element (18), which thermally connects the component (10) with the cooling body (22, 24). |
