发明名称 |
LASER MACHINING METHOD |
摘要 |
<p>Laser processing method comprises using a CO2 laser as laser light source which produces a pulsed laser light having a repeating frequency of more than 50 kHz, a pulse length of shorter than 200 ns. The laser beam (4) is deviated onto the substrate (6) to be processed using a deviating unit (2). Preferred Features: The laser beam has a wavelength of 9.2 +/- 0.2 microns. The laser pulse has an energy of 0.7 mJ. The laser beam is focussed on the substrate with a diameter of 50-200 microns. The material to be processed is an epoxy resin.</p> |
申请公布号 |
EP1480780(A1) |
申请公布日期 |
2004.12.01 |
申请号 |
EP20030709643 |
申请日期 |
2003.02.24 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
DE STEUR, HUBERT;ROELANTS, EDDY |
分类号 |
B23K26/0622;B23K26/386;B23K101/36;H05K3/00;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/0622 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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