发明名称 |
METHOD FOR POLISHING WORKPIECE |
摘要 |
PROBLEM TO BE SOLVED: To provide a wax-free polishing method for obtaining the same flatness as in a sticking method with water while obtaining the productivity exceeding the sticking method with water. SOLUTION: This method for polishing a workpiece 106 comprises a step of holding the workpiece 106 by vacuum suction via a nonlinear elastic member 104 which abuts on the workpiece 106 and conveying the workpiece 106 to a fixed position of a polishing apparatus and a step of holding the workpiece 106 with the nonlinear elastic member 104 and polishing the workpiece 106 by pressing it on a polishing member 107 of the polishing apparatus and sliding it relatively thereto. In this method, the polishing apparatus is operated in a condition of pressure of vacuum suction for holding the workpiece 106 lower than pressure for pressing the workpiece 106 to the polishing member 107. |
申请公布号 |
JP2002337048(A) |
申请公布日期 |
2002.11.26 |
申请号 |
JP20010145603 |
申请日期 |
2001.05.15 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
FUKAMI TERUAKI |
分类号 |
B24B37/30;H01L21/304;H01L21/677;H01L21/68 |
主分类号 |
B24B37/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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