发明名称 METHOD FOR POLISHING WORKPIECE
摘要 PROBLEM TO BE SOLVED: To provide a wax-free polishing method for obtaining the same flatness as in a sticking method with water while obtaining the productivity exceeding the sticking method with water. SOLUTION: This method for polishing a workpiece 106 comprises a step of holding the workpiece 106 by vacuum suction via a nonlinear elastic member 104 which abuts on the workpiece 106 and conveying the workpiece 106 to a fixed position of a polishing apparatus and a step of holding the workpiece 106 with the nonlinear elastic member 104 and polishing the workpiece 106 by pressing it on a polishing member 107 of the polishing apparatus and sliding it relatively thereto. In this method, the polishing apparatus is operated in a condition of pressure of vacuum suction for holding the workpiece 106 lower than pressure for pressing the workpiece 106 to the polishing member 107.
申请公布号 JP2002337048(A) 申请公布日期 2002.11.26
申请号 JP20010145603 申请日期 2001.05.15
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 FUKAMI TERUAKI
分类号 B24B37/30;H01L21/304;H01L21/677;H01L21/68 主分类号 B24B37/30
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