| 摘要 |
To provide an electric or electronic component (100) comprising a carrier substrate (10) of a semiconducting or insulating material, at least a recess (12), particularly a cavity or indentation provided in the carrier substrate (10), at least a component (14) which is inserted into the recess (12) and whose surface having at least an electrically conducting contact face (16) faces the bottom and/or wall area (18) of the recess (12) and is contacted in the bottom and/or wall area (18) of the recess (12), and at least a filling material (20) by means of which the component (14) inserted into the recess (12) is sealed particularly with the edges of the recess (12), as well as a method of manufacturing such a component, in which method, in comparison with the state of the art, larger tolerances in the position and particularly the tilt of the component (14) inserted into the recess (12) are allowed, it is proposed that at least an electrically conducting contact track (22) extending from the bottom and/or wall area (18) of the recess (12) to the surface (28) of the carrier substrate (10) is provided, and in that at least an electrically conducting connection element (24) is arranged between the respective contact face (16) of the component (14) and the respective section of the contact track (22) present in the bottom and/or wall area (18) of the recess (12), by which connection element the contact face (16) of the component (14) is connected to the section of the contact track (22) present in the bottom and/or wall area (18) of the recess (12). |
