Metal/ceramic circuit board and method for producing same

摘要

Producing metal/ceramic circuit board comprises forming metal layer on side(s) of ceramic substrate (10) and resist on metal layer, then etching and removing portion of metal layer with etchant of mixed solution. The metal layer contains aluminum as principal component. The resist layer is shaped. The etchant of mixed solution is prepared by mixing ferric chloride with water without adding any acids to form metal circuit on ceramic substrate side(s). An independent claim is included for metal/ceramic circuit board comprising ceramic substrate and metal circuit plate (12) on side(s) of the substrate. The metal circuit plate has skirt spreading length of = 200 Micro on peripheral edge of the metal circuit plate. The corrugated is the maximum distance between straight lines parallel to the linear peripheral edge of the metal circuit plate to be formed. The metal circuit plate has skirt spreading length of = 200 Micro. The ratio of skirt spreading length to the thickness of the metal circuit plate is = 0.5. The skirt spreading length is a distance between a plane perpendicular to the principal plane of the metal circuit plate at one end of the bottom face of the metal circuit plate on the same side as one end of the bottom face of the metal circuit plate. The distance is positive when bottom face has greater area than the top face.