发明名称 |
Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules |
摘要 |
A frame structure for a T/R tile module configured to transmit and receive electromagnetic radiation over a predetermined portion of the electromagnetic spectrum is provided. The frame component comprises at least one frame component formed as a single piece from a synthetic resin dielectric material. The frame component is configured to support a plurality of electrical connectors, and has a thin film coating configured to provide a ground connection and electromagnetic shield when the frame structure is incorporated into a transmit/receive module. A portion of the frame component is configured to interface with a portion of a T/R module when the frame component is incorporated into the T/R module, and the synthetic resin dielectric material provides the frame component with a range of compressibility that enables the frame component to provide the module with an effective ground connection over that range of compressibility.
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申请公布号 |
US6825817(B2) |
申请公布日期 |
2004.11.30 |
申请号 |
US20020210240 |
申请日期 |
2002.08.01 |
申请人 |
RAYTHEON COMPANY |
发明人 |
KOVACS ALAN L.;PETER MATTHEW H.;KETOLA KURT S.;LINDER JACQUES F. |
分类号 |
H01L25/18;H01L23/26;H01L23/552;H01L25/04;H01Q21/00;(IPC1-7):H01Q1/52 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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