发明名称 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules
摘要 A frame structure for a T/R tile module configured to transmit and receive electromagnetic radiation over a predetermined portion of the electromagnetic spectrum is provided. The frame component comprises at least one frame component formed as a single piece from a synthetic resin dielectric material. The frame component is configured to support a plurality of electrical connectors, and has a thin film coating configured to provide a ground connection and electromagnetic shield when the frame structure is incorporated into a transmit/receive module. A portion of the frame component is configured to interface with a portion of a T/R module when the frame component is incorporated into the T/R module, and the synthetic resin dielectric material provides the frame component with a range of compressibility that enables the frame component to provide the module with an effective ground connection over that range of compressibility.
申请公布号 US6825817(B2) 申请公布日期 2004.11.30
申请号 US20020210240 申请日期 2002.08.01
申请人 RAYTHEON COMPANY 发明人 KOVACS ALAN L.;PETER MATTHEW H.;KETOLA KURT S.;LINDER JACQUES F.
分类号 H01L25/18;H01L23/26;H01L23/552;H01L25/04;H01Q21/00;(IPC1-7):H01Q1/52 主分类号 H01L25/18
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