Device supporting apparatus

摘要

A device supporting assembly 4 includes a pair of heat sinks 18, a pair of support plates 17 arranged at opposite sides of the heat sinks 18 each for supporting eight semiconductor lasers 3 through a base 16, Peltier elements arranged between the heat sinks 18 and support plates 17, and thermistors 22 for measuring the temperature of the bases 16. The pair of heat sinks 18 have numerous fins in the form of comb teeth defining numerous openings acting as air passages between an air inlet and an air outlet. Exhaust fans 21 are arranged at outlet ends of the openings.