| 摘要 |
A NOVEL PROCESS AND APPARATUS ARE DISCLOSED FOR CLEANING WASTEWATER CONTAINING METAL IONS IN SOLUTION, HYDROGEN PEROXIDE, AND HIGH SOLIDS, E.G., GREATER THAN ABOUT 50 MG/L PARTICULATE SOLIDS. A CARBON ADSORPTION COLUMN REMOVES HYDROGEN PEROXIDE IN THE WASTEWATER FEED CONTAINING HIGH SOLIDS. A ION EXCHANGE UNIT REMOVES THE METAL IONS FROM SOLUTION. THE PROCESS AND APPARATUS REMOVE METAL IONS SUCH AS COPPER FROM A HIGH SOLIDS BYPRODUCT POLISHING SLURRY FROM THE CHEMICAL MECHANICAL POLISHING (CMP) OF INTEGRATED CIRCUIT MICROCHIPS TO FORM AN ENVIRONMENTALLY CLEAN WASTEWATER DISCHARGE. (FIGURE 1)
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