Method of mounting a butterfly package on a PCB

摘要

A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.