发明名称 Schottky diode with high field breakdown and low reverse leakage current
摘要 A Schottky diode structure and a method of making the same are disclosed. The method comprises following steps: firstly, a semiconductor substrate having a first conductive layer and an epi-layer doped with the same type impurities is provided. Then a first oxide layer is form on the epi layer. A patterning step to pattern first oxide layer and recess the epi layer (optional) is then followed to define guard rings. After stripping the photoresist pattern, a polycrystalline silicon layer formation is then followed. A boron and/or BF2<+> ion implant is then performed. Subsequently, a high temperature drive in process and oxidation process to oxidize the polycrystalline silicon layer and drive ions is then carried out. A second mask and etch steps are then performed to open the active regions. A metallization process is then done. A third mask and etch steps are then implemented to define anode. Finally, a backside metal layer is then formed and serves as a cathode.
申请公布号 US6825073(B1) 申请公布日期 2004.11.30
申请号 US20030663666 申请日期 2003.09.17
申请人 CHIP INTEGRATION TECH CO., LTD. 发明人 WU SHYE-LIN
分类号 H01L21/285;H01L21/329;H01L29/872;(IPC1-7):H01L21/338;H01L21/44;H01L21/20 主分类号 H01L21/285
代理机构 代理人
主权项
地址