发明名称 |
Circuit elements having an embedded conductive trace and methods of manufacture |
摘要 |
Disclosed is a circuit element that includes a thermoplastic substrate and a conductive trace at least partially embedded in the thermoplastic substrate. Also disclosed is a method of forming a circuit element. The method includes the steps of providing a thermoplastic substrate having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace, and embedding the trace into the thermoplastic substrate by heating the thermoplastic substrate to a temperature above about the softening temperature about the trace.
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申请公布号 |
US6824857(B2) |
申请公布日期 |
2004.11.30 |
申请号 |
US20020113733 |
申请日期 |
2002.04.01 |
申请人 |
NASHUA CORPORATION |
发明人 |
LOCHUN DARREN;IRELAND JOHN J. |
分类号 |
H01F5/00;H01F41/04;H05K1/03;H05K1/09;H05K3/10;H05K3/12;H05K3/24;H05K3/38;(IPC1-7):B32B15/00 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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