发明名称 |
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
摘要 |
A circuitized substrate including a plurality of conductive and dielectric layers and also a plurality of conductive thru-holes therein for passing high speed signals, e.g., from one component to another mounted on the substrate. The substrate utilizes a signal routing pattern which uses the maximum length of each of the thru-holes wherever possible to thereby substantially eliminate signal loss (noise) due to thru-hole "stub" resonance. A multilayered circuitized substrate assembly using more than one circuitized substrate, an electrical assembly using a circuitized substrate and one or more electrical components, a method of making the circuitized substrate and an information handling system incorporating one or more circuitized substrate assemblies and attached components are also provided.
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申请公布号 |
US2005039950(A1) |
申请公布日期 |
2005.02.24 |
申请号 |
US20040955741 |
申请日期 |
2004.09.30 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
CHAN BENSON;LAUFFER JOHN M. |
分类号 |
H01L23/12;H01L23/31;H01L23/538;H01L25/065;H01L25/18;H05K1/02;H05K1/11;H05K3/46;(IPC1-7):H05K7/06 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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