发明名称 REALTIME MONITORING SYSTEM USING LIGHT SOURCE, TEMPERATURE DETECTION DEVICE AND LIGHT DETECTION DEVICE AND METHOD FOR BONDING PROCESS
摘要 PURPOSE: A high-resolution monitoring system and a method thereof are provided to monitor a bonding state in real time. CONSTITUTION: A high-resolution monitoring system includes a light source(51) for irradiating a laser ray(54) at a sample(55). A heating device(52) applies heat to the sample(55). A temperature detection device is provided to detect a temperature of the sample. A light detection device(59) is provided to detect the light transmitted to the sample in order to change to an image signal. A controller(62) outputs the image signal received from the light detection device and controls the light source(51) and the heating device(52). The light source(51) radiates an X-ray or an ultrasonic wave. The heating device(52) includes one selected from the group consisting of a laser, a heating wire, and a heating plate. The temperature detection device includes a pyrometer or a thermocouple.
申请公布号 KR20040098687(A) 申请公布日期 2004.11.26
申请号 KR20030030898 申请日期 2003.05.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JAE CHEOL;LEE, JONG SIK;MUN, GI TAE
分类号 G01B15/00;G01B17/00;G01B17/06;G01N21/88;G01N23/04;G01N29/04;H05K3/34;(IPC1-7):G01N21/88 主分类号 G01B15/00
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