| 摘要 |
This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6'), the contact terminals (7') of which face essentially towards the second surface of the insulating-material layer and which is connected electrically by its contact terminals (7') to the conductor structures contained in the electronic module, is attached by means of glue or two-sided tape to the first component (6), and the contact terminals (7, 7') are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7'). By means of the invention, it is possible to achieve a simple module construction comprising two component layers, which permits the manufacture of smaller electronic devices than previously. |
