| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive copper paste composite which forms a cured product having excellent conductivity and sufficient reliability. SOLUTION: This conductive copper paste composite contains at least copper powder, a thermosetting resin, and salicyl alcohol. The composite preferably additionally contains one or more kinds selected from a group comprising lead, a lead compound, bismuth, and a bismuth compound. The composite also preferably contains an imidazole compound. The composite preferably additionally contains a thermosetting resin having a hydroxyl group, preferably a phenoxy resin in particular. This conductive copper paste composition is suitably used for a jumper circuit and a through-hole part in a printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI
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