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发明名称	CHIP SIZE PACKAGE
摘要
申请公布号	KR100460071(B1)	申请公布日期	2004.11.25
申请号	KR19980004336	申请日期	1998.02.13
申请人	HYNIX SEMICONDUCTOR INC.	发明人	JANG, CHAE GYU;JUNG, SEONG TAE
分类号	H01L23/28;(IPC1-7):H01L23/28	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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