| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a tape carrier for TAB which hardly generates wave in a separated end face or tear in a circuit pattern, and which is capable of efficiently manufacturing the highly reliable tape carrier for TAB. <P>SOLUTION: An insulating layer 2 is formed on a continuous supporting metal layer 1 by applying and drying resin solution and, thereafter, a plurality of rows of wiring patterns 3 are formed on the insulating layer 2 by semi additive method. Thereafter, slit grooves S are formed between respective rows of wiring patterns 3 on the supporting metal layer 1, then, the insulating layer 2 is torn along the slit grooves S to separate the layer into individual rows whereby the tape carrier 12 for TAB is obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
