METHOD OF PRODUCING CAM DATA FOR ELECTRONIC CIRCUIT BOARD, CAD/CAM SYSTEM FOR ELECTRONIC CIRCUIT BOARD, COMPUTER PROGRAM USED THEREFOR, AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To properly and efficiently convert CAD (computer aided design) data considering the inner diameter of an opening in a solder resist layer into CAM (computer aided manufacturing) data having an inner diameter D' of the opening in a photolithographic exposure mask to form the opening, while preventing problems characteristic to a pad-on-via part.

SOLUTION: The inner diameter D' of an opening in a solder resist layer reflected in the CAD data is converted into the outer diameter D0of the mask pattern for an opening in a photolithographic exposure mask as the CAM data in order to form the opening in the solder resist layer by photolithographic processes using a photosensitive resin. In the openings formed in the solder resist layer 8, the opening having a metal pad 10' laid as exposed inside the opening and having the metal pad 10' as a pad-on-via part is defined as a first kind of opening 8a', while the opening forming a pad-off-via part is defined as a second kind of opening. The outer diameter D0of the mask pattern for an opening is corrected in such a manner that the ratio D0/D' of the outer diameter D0to the inner diameter D' of the opening becomes larger in the first kind of opening than in the second kind of opening 8a.

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