发明名称 METHOD AND DEVICE FOR SPLITTING PLANAR MEMBER
摘要 PROBLEM TO BE SOLVED: To produce an extremely thin chip having a good end face shape while preventing occurrence of an unsplit part, chipping or cracking. SOLUTION: In the method for splitting a planar member, a linear reforming region K is formed on the surface of the planar member W made of a fragile material or in the planar member W, and then the planar member W is split along the linear reforming region to obtain a plurality of sheets of substrate. The splitting method comprises a step for pasting a tape S to the surface of the planar member W, a step for forming a reforming region K on the surface of the planar member applies with the tape or in the planar member, and a step for expanding the tape S by applying a tension thereto after forming the reforming region. In the expanding step, a tension is applied at first to the tape S pasted to the outer circumferential part of the planar member W, and then applied to the tape S pasted to the planar member W on the inner circumferential side of the part applied with the tension. Subsequently, a tension is applied sequentially to the tape S toward the inner circumferential side of the planar member W. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335909(A) 申请公布日期 2004.11.25
申请号 JP20030132574 申请日期 2003.05.12
申请人 TOKYO SEIMITSU CO LTD 发明人 SAKATANI YASUYUKI;AZUMA MASAYUKI
分类号 H01L21/301;(IPC1-7):H01L21/301 主分类号 H01L21/301
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