| 摘要 |
PROBLEM TO BE SOLVED: To improve the electrical connectability or reliability of a multilayered printed wiring board by hindering the flow of a conductive bump in a substrate at the time of mounting an electronic component, such as the IC chip etc., or performing heat cycle tests. SOLUTION: The multilayered wiring board is constituted by laminating two or more circuit boards, each of which is obtained by forming via holes, by packing conductors in non-through holes formed in an insulating substrate having a conductor layer on one surface or conductor layers on both surfaces, and forming conductive bumps on the via holes upon another. Then the circuit boards are connected to each other through the conductive bumps, and solder bumps are formed on the conductor layer of the outermost circuit board. The conductive bumps contain Cu. COPYRIGHT: (C)2005,JPO&NCIPI |
