DEVICE FOR MANUFACTURING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a device for manufacturing a semiconductor capable of capturing a foreign material on a stage and suppressing an increase in leakage of inert gases. SOLUTION: As a size of a budget part 13 is generally about 0.375 mm, a size of an adhesive sheet 12 is required to be 199.25 mm, and to be standardized as 199±0.25 mm because a distance 14 between the budget part 13 of a wafer 11 and an end face of the adhesive sheet 12 is required to be as close as to zero. The foreign particle 16 existing on the stage 15 regardless of its position in an central part or in the vicinity of edges can be captured by covering the whole flat surface of the wafer 11 by the adhesive sheet 12, and by absorbing the wafer 11 onto the stage 15 adhered by the adhesive sheet 12 with an electrostatic chuck. COPYRIGHT: (C)2005,JPO&NCIPI