| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic wiring board which is improved in yield and the shape of which is little distorted. SOLUTION: The ceramic wiring board 101 manufactured by this method is constituted by laminating a ceramic layer 102 and conductive layers 131 and 132 upon one another so that the conductive layers 131 and 132 are exposed on both main surfaces of the board 101. The ceramic wiring board 101 is formed by forming a metallized sheet body 101 constituted of a first ceramic sheet 102 and first conductive paste which is printed on the main surfaces of the ceramic sheet 102 and becomes the conductive layers 131 and 132, and baking the sheet body 101 in an oxidizing atmosphere while the sheet body 101 is held between a pair of sheets 201 for baking in a state that the sheets 201 are closely adhered to the whole main surfaces of the sheet body 101. Each sheet 201 is constituted of a second ceramic sheet 202 and second conductive paste 203 printed on the main surface of the sheet 202. COPYRIGHT: (C)2005,JPO&NCIPI
|
