| 摘要 |
PROBLEM TO BE SOLVED: To achieve a remarkable cost reduction by making it possible to measure chip characteristics in the wafer state; otherwise, in individually diced chips, the discrimination judgement between the front and rear surfaces thereof, and the top and bottom, the right and left thereof is needed prior to the characteristics measuring, resulting in an expensive distinguishing device. SOLUTION: A plurality of fine conductive wires 20 embedded in an elastic elastomer layer 22 linearly extend nearly perpendicular to the front and rear surfaces of the elastomer layer 22. Dent parts are formed on the peripheries of bores of the elastomer layer 22 in which the fine conductive wires are embedded. The whole length of the fine conductive wires 20 is nearly identical to the thickness of the elastomer layer 22, or both ends of the fine conductive wires 20 protrude from the front and rear surfaces of the elastomer layer 22, an FPC 18 having electric contacts 12 being connected with the fine conductive wires 20 on either the front surface or the rear surface of the elastomer 22. The surface opposite to the surface connected with the FPC 18 may be connected with a hard board 30. COPYRIGHT: (C)2005,JPO&NCIPI
|
