发明名称 PLATING METHOD, AND PLATING FIXTURE
摘要 PROBLEM TO BE SOLVED: To provide a plating fixture with which the circumferential flow of plating liquid is not disturbed, the opening part of a plating tank is completely covered and many parts are plated in a single plating process. SOLUTION: The plating fixture 30 consists of an annular part 31 obtained by bending a wire rod such as wire and a handle part 32. Linear suspension members 33 are connected to the annular part 31, each suspension member 33 is fitted with five objects 11 to be plated, and the objects 11 to be plated are arranged closely to the inner circumferential face of a beaker 8. Without the plating fixture 30, only 10 pieces of the objects 11 to be plated can be arranged in the beaker 8 with the same size, however in this example, 20 pieces of the suspension members 33 are fitted, and about 100 pieces of the objects to 11 to be plated can be fitted thereto. The plating fixture is placed on the opening part of the beaker 8, a circular cover member 36 curved into the shape of a convex lens is placed so as to be convex downward, and the covering is securely performed to prevent the deterioration of the liquid. The circumferential flow of the plating liquid by a stirring means is not disturbed by the objects to be plated and the fixture arranged at the inner circumferential face, and the plating is uniform. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004332000(A) 申请公布日期 2004.11.25
申请号 JP20030125259 申请日期 2003.04.30
申请人 ANRITSU CORP 发明人 NAITOU YOSHINOBU;KAWAMATA YOICHI;HORIUCHI MASAO;IWASAKI KATSUMI
分类号 C23C18/31;(IPC1-7):C23C18/31 主分类号 C23C18/31
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